mirror-linux/Documentation/devicetree/bindings/thermal
Linus Torvalds 667de5c684 More thermal control updates for 6.4-rc1
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs check
    warning (Stefan Wahren).
 
  - Update the example in the DT bindings to reflect changes with the
    ADC node name for QCom TM and TM5 (Marijn Suijten).
 
  - Fix comments for the cpuidle_cooling_register() function to match the
    function prototype (Chenggang Wang).
 
  - Fix inconsistent temperature read and some Mediatek variant board
    reboot by reverting a change and handling the temperature
    differently (AngeloGioacchino Del Regno).
 
  - Fix a memory leak in the initialization error path for the Mediatek
    driver (Kang Chen).
 
  - Use of_address_to_resource() in the Mediatek driver (Rob Herring).
 
  - Fix unit address in the QCom tsens driver DT bindings (Krzysztof
    Kozlowski).
 
  - Clean up the step-wise thermal governor (Zhang Rui).
 
  - Introduce thermal_zone_device() for accessing the device field of
    struct thermal_zone_device and two drivers use it (Daniel Lezcano).
 
  - Clean up the ACPI thermal driver a bit (Daniel Lezcano).
 
  - Delete the thermal driver for Intel Menlow platforms that is not
    expected to have any users (Rafael Wysocki).
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Merge tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull more thermal control updates from Rafael Wysocki:
 "These are mostly cleanups on top of the previously merged thermal
  control changes plus some driver fixes and the removal of the Intel
  Menlow thermal driver.

  Specifics:

   - Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
     check warning (Stefan Wahren)

   - Update the example in the DT bindings to reflect changes with the
     ADC node name for QCom TM and TM5 (Marijn Suijten)

   - Fix comments for the cpuidle_cooling_register() function to match
     the function prototype (Chenggang Wang)

   - Fix inconsistent temperature read and some Mediatek variant board
     reboot by reverting a change and handling the temperature
     differently (AngeloGioacchino Del Regno)

   - Fix a memory leak in the initialization error path for the Mediatek
     driver (Kang Chen)

   - Use of_address_to_resource() in the Mediatek driver (Rob Herring)

   - Fix unit address in the QCom tsens driver DT bindings (Krzysztof
     Kozlowski)

   - Clean up the step-wise thermal governor (Zhang Rui)

   - Introduce thermal_zone_device() for accessing the device field of
     struct thermal_zone_device and two drivers use it (Daniel Lezcano)

   - Clean up the ACPI thermal driver a bit (Daniel Lezcano)

   - Delete the thermal driver for Intel Menlow platforms that is not
     expected to have any users (Rafael Wysocki)"

* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
  thermal: intel: menlow: Get rid of this driver
  ACPI: thermal: Move to dedicated function sysfs extra attr creation
  ACPI: thermal: Use thermal_zone_device()
  thermal: intel: pch_thermal: Use thermal driver device to write a trace
  thermal: core: Encapsulate tz->device field
  thermal: gov_step_wise: Adjust code logic to match comment
  thermal: gov_step_wise: Delete obsolete comment
  dt-bindings: thermal: qcom-tsens: Correct unit address
  thermal/drivers/mediatek: Use of_address_to_resource()
  thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
  thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
  thermal/drivers/mediatek: Add temperature constraints to validate read
  Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
  thermal/drivers/cpuidle_cooling: Delete unmatched comments
  dt-bindings: thermal: Use generic ADC node name in examples
  dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
2023-05-03 11:46:01 -07:00
..
allwinner,sun8i-a83t-ths.yaml dt-bindings: Remove 'Device Tree Bindings' from end of title: 2022-08-25 14:06:57 -05:00
amazon,al-thermal.txt
amlogic,thermal.yaml dt-bindings: thermal: Drop unneeded quotes 2023-04-07 11:18:28 +02:00
armada-thermal.txt
brcm,avs-ro-thermal.yaml
brcm,avs-tmon.yaml
brcm,bcm2835-thermal.txt
brcm,ns-thermal.yaml
brcm,sr-thermal.txt
da9062-thermal.txt
db8500-thermal.txt
dove-thermal.txt
fsl,scu-thermal.yaml dt-bindings: drop redundant part of title (manual) 2022-12-16 12:51:43 -06:00
generic-adc-thermal.yaml dt-bindings: thermal: Convert generic-adc-thermal to DT schema 2022-12-14 15:25:39 +01:00
hisilicon-thermal.txt
imx-thermal.yaml dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible 2023-04-26 10:38:20 +02:00
imx8mm-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
kirkwood-thermal.txt
max77620_thermal.txt
mediatek,lvts-thermal.yaml dt-bindings: thermal: mediatek: Add LVTS thermal controllers 2023-02-15 17:28:34 +01:00
mediatek-thermal.txt dt-bindings: thermal: mediatek: Add binding documentation for MT8365 SoC 2023-03-13 12:20:34 +01:00
nvidia,tegra30-tsensor.yaml
nvidia,tegra124-soctherm.txt
nvidia,tegra186-bpmp-thermal.yaml
qcom,spmi-temp-alarm.yaml
qcom-lmh.yaml dt-bindings: Drop type from 'cpus' property 2022-12-06 14:50:35 -06:00
qcom-spmi-adc-tm-hc.yaml dt-bindings: thermal: Use generic ADC node name in examples 2023-04-26 10:38:28 +02:00
qcom-spmi-adc-tm5.yaml dt-bindings: thermal: Use generic ADC node name in examples 2023-04-26 10:38:28 +02:00
qcom-tsens.yaml dt-bindings: thermal: qcom-tsens: Correct unit address 2023-04-26 10:38:35 +02:00
qoriq-thermal.yaml dt-bindings: thermal: Drop unneeded quotes 2023-04-07 11:18:28 +02:00
rcar-gen3-thermal.yaml dt-bindings: thermal: rcar-gen3-thermal: Add r8a779g0 support 2023-02-15 17:28:51 +01:00
rcar-thermal.yaml dt-bindings: Fix incorrect "the the" corrections 2022-08-18 10:59:33 -07:00
rockchip-thermal.yaml dt-bindings: rockchip-thermal: Support the RK3588 SoC compatible 2023-04-07 10:31:33 +02:00
rzg2l-thermal.yaml dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC 2022-12-14 15:25:41 +01:00
samsung,exynos-thermal.yaml
socionext,uniphier-thermal.yaml dt-bindings: thermal: Fix node descriptions in uniphier-thermal example 2022-12-26 16:09:29 -06:00
spear-thermal.txt
sprd-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
st,stm32-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
st-thermal.txt
thermal-cooling-devices.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
thermal-idle.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
thermal-sensor.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
thermal-zones.yaml dt-bindings: Add missing (unevaluated|additional)Properties on child node schemas 2023-04-05 15:38:38 -05:00
ti,am654-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
ti,j72xx-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
ti_soc_thermal.txt